Shanghai (Cina)
October 25, 2021
SPEA lands at MWS 2021
Find out more on SPEA’s technologies presented at MWS 2021
SPEA wants to thank everyone who attended the MEMS World Summit in Shanghai on 19-20 October 2021. We strongly believe in the potential of such significant and constructive events for the semiconductor industry.
Having the opportunity to take part in workshops, interactive panel discussions, roundtable discussions and business meetings along with field experts gives us a starter point for progress, improvement and growth.
We have introduced the most advanced SPEA MEMS Test Cell. This test cell combines fast and gentle pick&place handling, reliable contacting and complete final test capabilities, including electrical test, physical stimulus for functional test and calibration, and tri-temp thermal conditioning.
Discover more on SPEA MEMS Test Cell >
