Turin (Italy)
June 14, 2023
Luca Fanelli’s Speech Awarded at SWTest 2023
Luca Fanelli, SPEA America’s President and GM, recently presented at the SWTest 2023 Conference. His presentation – Flying Probe Card Design for Medical and Other Challenging Applications – was awarded as the Most Inspirational of the Conference.
The paper explored the challenges posed on the wafer test process by some of the most recent wafer design trends, such as ever-shrinking form factor, uneven wafer layout geometries, non-square dies and diversified die orientation, multi-project wafers.
Many wafers, nowadays, cannot be tested by the means of standard probe cards, as they do not present standard layout geometries, or they require to be contacted from both sides simultaneously.
To ensure these challenges are met, SPEA developed a new prober architecture, based on multiple, mobile probe cards that are moved by robotic axes, touching the wafer from both top and bottom sides simultaneously.
This innovative approach moves the limit posed by testability issues to wafer layout design, extending the range of applications that can be fully tested at wafer level, also including multi-project wafers, unconventional layouts and high-density geometries.
For further information on this new architecture and how it serves the increasing demand to increase wafer test efficiency while minimizing the cost per die, visit the product page here.
About SWTest
The annual SWTest Conference is the only industry conference that focuses on all aspects of semiconductor wafer and die level probe testing.
The conference has the perfect mixture of manufacturer and vendor presentations. It is not a sales show, nor an academic or theoretical conference.
It is a probe technology forum where attendees come to learn about recent developments in the industry and exchange ideas.
